
Tech sheetAremco wrote:FEATURES
Aremco-Bond(TM) 556-LV is an advanced, two-part, low viscosity conductive adhesive formulated using high purity silver flake. This system exhibits a volume resistivity of less than 0.0008 ohm-cm at room temperature, and a thermal conductivity of 2.2 W/m-°K. The continuous operating temperature range is 340°F (141°C) and intermittent use temperature is 375°F (190°C). The tensile shear strength is 1,100 psi and Shore D hardness is 84. Viscosity range is 4,000 to 6,000 cP.
Aremco-Bond(TM) 556-LV mixes easily in a 100-to-4 ratio by weight. It sets at room temperature in 24 hours or can be heat cured in 2 hours at 200°F. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.
Typical applications for Aremco-Bond(TM) 556-LV include microelectronic chip bonding, semiconductor dieattach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.
http://www.aremco.com/PDFs/A8_09.pdf